MBO’s advanced digital finishing equipment helps printers optimize their HP PageWide and Indigo Presses to improve production efficiency

Meet MBO’s digital finishing experts in booth 18 at Dscoop and Jetcomm this week in Phoenix

Philadelphia and Phoenix, AZ (DSCOOP) — March 1, 2017 — MBO America announces its official sponsorship and support of Dscoop and Jetcomm 2017, a global cooperative of HP digital solution users including HP PageWide and Indigo Press users. MBO is proud to support Dscoop and Jetcomm by providing its expertise in digital finishing to Dscoop members. Dscoop 2017 is being held March 1-4, 2017 at the Phoenix Convention Center, with Jetcomm co-located on March 1-2, 2017.

MBO Fully Supports HP Digital Users Worldwide

At Dscoop 2017 in booth 18, HP users will have the chance to meet with MBO executives to learn about the company’s popular finishing systems for HP digital applications. MBO is known for being especially suited to digital direct mail, commercial finishing, pharmaceutical applications, die cutting, and folding carton packaging.

“As a proven HP finishing partner, MBO America is proud to support the Jetcomm and Dscoop events. Finishing plays a huge role in a printer’s ability to optimize their presses, which is why the combination of HP and MBO has been so successful.” says Lance Martin, Director of Sales, MBO America. “Being here, at Dscoop, gives HP users the perfect opportunity learn about available equipment and get advice from MBO digital finishing experts. Many HP users are already enjoying success while running MBO digital finishing systems with PageWide and Indigo platforms, and we’re happy to help more achieve similar results.”

MBO’s broad array of advanced finishing solutions – such as 20″ and 30″ digital web finishing systems; K8-RS High Speed Inline Signature and Book Block Production System; and the BSR 550 Servo rotary die cutting system for inline direct mail and packaging applications — help printers the world-over optimize their high-speed presses and improve production efficiency.